Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics. Key Responsibilities: • Design compact mechanical housing to operate under 250°C ambient conditions. • Ensure internal core temperature remains under 55°C during runtime. • Select and integrate miniaturized components (compute, battery, sensors). • Strip sensor casings and reassemble into a custom mount with thermal shielding. • Perform heat simulation, thermal insulation, and shock-resistance design. • Test hardware in specified sites and environments. Job Requirements: • Bachelor or Master in Mechanical Engineering, Mechatronics, or similar. • Strong experience in heat-resistant enclosure design and miniaturized hardware integration. • Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.). • Experience with IP65/ IP67 standards, fanless computing, and embedded design. • Knowledge of fire-fighting robot or harsh-environment robotic platforms is a plus. Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics We regret to inform that only shortlisted candidates will be notified.