Research Engineer (Temporary Bonding and Debonding) (APM), IME

Job DescriptionAs a Research Engineer in the Wafer-to-Wafer (W2W) Bonding Module, you will work on Temporary Bonding and Debonding (TBDB) processes—an essential step in advanced semiconductor packaging for handling ultra-thin wafers. This role focuses on process development, optimization, and stabilization to enable next-generation packaging technologies. Key Responsibilities: • Developing and optimizing temporary bonding and debonding processes for wafer-level packaging. • Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding. • Investigate and resolve process issues and defects such as voids, warpage, and delamination. • Plan and execute Design of Experiments (DOE) for process development. • Collect, analyze data, and document findings in technical reports. Job Requirements: • Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering. • Experience in TBDB process development or advanced packaging technologies is an advantage. • Strong analytical and problem-solving abilities. • Good communication and teamwork skills. • Ability to work in a cleanroom environment and handle precision equipment. The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.