Scientist (Plasma Process Module with specialty in Dielectrics/Conductor hardware plasma Source)

Job Responsibilities: • Develop and sustain Dry etch processes in R&D and Small volume manufacturing environment. • Responsible for performing professional process engineering research, from the concept to the final process development for a wide variety of materials. (Metals, Silicon, Dielectrics, SiC and other speciality materials) • Responsible for metal and oxide layers etch with devices integration on top of metasurface and electrical isolation at unit cell level for sub-100nm technology. • May conceive and plan projects involving the definition and selection of new materials, concepts and approaches in the processing or developing of new processes. • Compiles and evaluates test data to determine appropriate limits and variables for process specifications. • Championing engineering experiments for process characterization to drive quality and yield improvement. • Set up and collect the experimental data and generate reports for internal and customer distribution. • Design and complete DOE (Design of Experiments) evaluations to characterize process window for new requirements. • Work closely with senior staff and process integrators to understand technology roadmaps, process capability requirements and business issues/ challenges. • Act as a resource for colleagues with less experience; lead small projects with manageable risks. • Act as subject matter expert for both internal and external stakeholders. • Accelerate parallel process development capability to meet aggressive project timelines and supporting faster innovation cycles. • Build a sustainable talent pipeline across both research and engineering levels. Job Requirements: • PhD in Materials Science, Metallurgy, Electrical, Electronics, Chemical Engineering, Chemistry or Physics; or relevant field science and engineering fields. • Candidates with plasma or semiconductor process exposure are added advantages. • Prior experience in dry RIE etch processes is preferred. • Knowledge of plasma fundamentals is an added advantage. • Hands-on experience in designing and executing experiments (DOE), statistical and cause analysis, and problem-solving methods. • Possess good interpersonal and communication skills. Job Responsibilities: • Develop and sustain Dry etch processes in R&D and Small volume manufacturing environment. • Responsible for performing professional process engineering research, from the concept to the final process development for a wide variety of materials. (Metals, Silicon, Dielectrics, SiC and other speciality materials) • Responsible for metal and oxide layers etch with devices integration on top of metasurface and electrical isolation at unit cell level for sub-100nm technology. • May conceive and plan projects involving the definition and selection of new materials, concepts and approaches in the processing or developing of new processes. • Compiles and evaluates test data to determine appropriate limits and variables for process specifications. • Championing engineering experiments for process characterization to drive quality and yield improvement. • Set up and collect the experimental data and generate reports for internal and customer distribution. • Design and complete DOE (Design of Experiments) evaluations to characterize process window for new requirements. • Work closely with senior staff and process integrators to understand technology roadmaps, process capability requirements and business issues/ challenges. • Act as a resource for colleagues with less experience; lead small projects with manageable risks. • Act as subject matter expert for both internal and external stakeholders. • Accelerate parallel process development capability to meet aggressive project timelines and supporting faster innovation cycles. • Build a sustainable talent pipeline across both research and engineering levels. Job Requirements: • PhD in Materials Science, Metallurgy, Electrical, Electronics, Chemical Engineering, Chemistry or Physics; or relevant field science and engineering fields. • Candidates with plasma or semiconductor process exposure are added advantages. • Prior experience in dry RIE etch processes is preferred. • Knowledge of plasma fundamentals is an added advantage. • Hands-on experience in designing and executing experiments (DOE), statistical and cause analysis, and problem-solving methods. • Possess good interpersonal and communication skills. The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.