About this role
RESPONSIBILITIES : • Understand customer's problems (needs and wants), design and recommends solutions to meet their needs and ensures customer satisfaction. • Lead the design/delivery of TCI (Test Cell Integration) or multiple technologies solutions. • Prepare training documents to both in-house engineers and customer training needs. • Conduct relevant application support service trainings and co-trainer in customer training. • Able to lead a project team to accomplish projects in a timely manner. • Holding key customer account and manages projects together with factory engineering to meet customer’s needs in both technical requirements and time schedule. • Understands and applies Solution Planning & Implementation standards. • Build and establish strong relationships with factory to co-develop solutions to IPG related problems. • To be effectively identifying design related problems and suggest necessary changes to the factory through an orderly reporting manner. • Take initiative to own and solve specific customer issues. REQUIREMENTS: • At least 2 years relevant experience • Good knowledge of semiconductor assembly and test industry. Preferably have experiences developing test programs or have supported test applications on at least one of the following product or technologies; Advantest, Verigy, LTX-Credence, Teradyne, MEMs testing, load board design and sockets • Good knowledge of test sockets (Contactors) design concept • Loadboard/Probecard design requirements and debugging • Flexibility and willingness to travel and support customers globally • Minimum Bachelor Degree or equivalent in electronics and electrical engineering from a recognized university. • Good command of written and spoken English with strong interpersonal skills. • Knowledge of using MS Office (Words, Excel & PowerPoint) is mandatory. • Added advantage with knowledge of CAD software (AutoCAD, SolidWorks) • This is a 1-year contract role (renewable), with an immediate start preferred.
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